Samsung is accelerating construction of 2-nanometer mass-production capacity at its Taylor, Texas plant and deepening its collaboration with Broadcom, part of a broader industry scramble to keep pace with surging demand for AI chips. TSMC, meanwhile, has doubled its advanced packaging production capacity every year for the past three years and now operates ten dedicated packaging facilities — yet still struggles to fully meet demand.
The two companies remain far apart in scale: TSMC currently holds roughly 73% of the global foundry market, while Samsung sits around 7%. But Samsung's push into sub-2nm processes and advanced packaging, paired with its U.S. manufacturing footprint, positions it to compete more directly for AI chip orders that need domestic production for supply-chain or national-security reasons.
Both companies have agreed to defer deployment of next-generation High-NA EUV lithography equipment until around 2030, when they plan to target the even smaller 1-nanometer node rather than rushing the technology into current production lines. Intel's 18A process and Japan's Rapidus are also racing to establish themselves in the increasingly crowded advanced-node market, underscoring how central leading-edge chip manufacturing has become to the broader AI buildout.
